www.3dic.org/3D RRAM

3D RRAM (Resistive random-access memory)

3D Horizontal X-Point Architecture and Vertical X-Point Architecture

Horizontal X-point and vertical X-point architectures.png
3D Horizontal X-Point Architecture (left) and Vertical X-Point Architecture (right).[1]

3D RRAM Technologies

  • Samsung’s 3D RRAM
I. G. Baek, et al., IEDM, 2009 & 2011(Samsung)
  • Crossbar’s 3D RRAM
Crossbar is a startup company founded in 2010, based in California, USA.

Crossbar's patented built-in select feature allows thousands of Crossbar’s RRAM cells to be inter-connected in true cross-point memory arrays. This extremely dense memory arrays with the capability to scale below 10nm, storing multiple bits per cell and stacking 3D layers provides a path towards TeraBytes on a single die.

  • Macronix's 3D RRAM
W.-C. Chien , et al., VLSI, 2012(Macronix)
  • IMEC's 3D RRAM
L. Zhang, et al., IMW, 2013(IMEC)
  • Stanford
H.-Y. Chen, et al., IEDM, 2012 (Stanford)
S. Yu, H.-Y. Chen, et al., VLSIT, 2013 (Stanford)


  1. H. S. Yoon, I.-G. Baek, J. Zhao, H. Sim, M. Y. Park, H. Lee, G.-H. Oh, J. C. Shin, I.-S. Yeo, and U.-I. Chung, “Vertical cross-point resistance change memory for ultra-high density non-volatile memory applications,” in 2009 Symposium on VLSI Technology, 2009, pp. 26–27.