3D packaging

www.3dic.org/3D packaging

3D packaging refers to 3D integration schemes that rely on traditional methods of interconnect such as wire bonding and Flip-Chip to achieve vertical chip or package (Package-on-Package or PoP) stacks.

Chip-on-Chip Stacking

Chip stacking can be realized by wire bonding, Flip-Chip, microbumps, or direct bonding.

Package-on-Packaging Stacking

Package stacking is typically realized by Flip-Chip or microbumps.