Silver sintering is a bonding technology using Ag micro-/nanoparticles extensively studied for die attach to prvoide superior thermal conductivity and reliability. A magor advantage of silver sintering process is it can be done at relatively low temperature and in air without high compression pressure or even pressure-less. The first studies on silver sintering as a die attach technique date back from the end of the eighties at Infineon.
Fang Yu et al. optimized the pressure-assisted sitnering process, decreasing the sintering time to 1 min under 7.6 MPa compression and at 300 °C. 
In Ag sintering die attach, the Cu surface of the direct bonded copper (DBC) substrates is typically finished by Ni/Au or Ag, since oxidation of the Cu layer during Ag sintering is not acceptable.
- F. Yu, R. W. Johnson, and M. C. Hamilton, “Process Optimization of Pressure-Assisted Rapid Ag Sintering Die Attach for 300 °C Applications,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 7, no. 6, pp. 855–861, Jun. 2017. Available: http://dx.doi.org/10.1109/TCPMT.2017.2693919