Centip3De

www.3dic.org/Centip3De

Centip3De (pronounced ‘‘centipede’’) is a 64-core, 3D stacked near-threshold system developed by researchers at University of Michigan under a DARPA program.


Introduction

Centip3De uses the synergy between 3D integration and near-threshold computing to create a reconfigurable system that provides both energy-efficient operation and techniques to address single-thread performance bottlenecks.[1] The original Centip3De design was a seven-layer 3D stacked design with 128 cores and 256 Mbytes of DRAM. Centip3De used Tezzaron’s 3D stacking technology in conjunction with Global Foundries’ 130-nm process. Silicon results showed a two-layer, 64-core system in 130-nm technology, which achieved an energy efficiency of 3,930 DMIPS/W.


References

  1. R. G. Dreslinski, D. Fick, B. Giridhar, G. Kim, S. Seo, M. Fojtik, S. Satpathy, Y. Lee, D. Kim, N. Liu, M. Wieckowski, G. Chen, D. Sylvester, D. Blaauw, and T. Mudge, “Centip3De: A 64-Core, 3D Stacked Near-Threshold System,” IEEE Micro, vol. 33, no. 2, pp. 8–16, Mar. 2013. Available: http://dx.doi.org/10.1109/MM.2013.4