Centip3De (pronounced ‘‘centipede’’) is a 64-core, 3D stacked near-threshold system developed by researchers at University of Michigan under a DARPA program.


Centip3De uses the synergy between 3D integration and near-threshold computing to create a reconfigurable system that provides both energy-efficient operation and techniques to address single-thread performance bottlenecks.[1] The original Centip3De design was a seven-layer 3D stacked design with 128 cores and 256 Mbytes of DRAM. Centip3De used Tezzaron’s 3D stacking technology in conjunction with Global Foundries’ 130-nm process. Silicon results showed a two-layer, 64-core system in 130-nm technology, which achieved an energy efficiency of 3,930 DMIPS/W.


  1. R. G. Dreslinski, D. Fick, B. Giridhar, G. Kim, S. Seo, M. Fojtik, S. Satpathy, Y. Lee, D. Kim, N. Liu, M. Wieckowski, G. Chen, D. Sylvester, D. Blaauw, and T. Mudge, “Centip3De: A 64-Core, 3D Stacked Near-Threshold System,” IEEE Micro, vol. 33, no. 2, pp. 8–16, Mar. 2013. Available: http://dx.doi.org/10.1109/MM.2013.4