DiRAM

www.3dic.org/DiRAM

Dis-integrated Random Access Memory (DiRAM) is a 3D memory stacked on logic circuits developed by Tezzaron, based on wafer bonding and SuperContacts™ technologies.


DiRAM Architecture

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DiRAM4™ 3D Memory.[1]


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8-layer stacked wafers fabricated by DBI wafer bonding and SuperContacts.[2]