The Electronic Components and Technology Conference (ECTC) is the premier international event that brings together the best in packaging, components and microelectronic systems science, technology and education in an environment of cooperation and technical exchange. ECTC is sponsored by the Components, Packaging and Manufacturing Technology (CPMT) Society of the IEEE. The 2017 ECTC will be held at The Walt Disney World Swan and Dolphin Resort, Lake Buena Vista, Florida, USA, during May 30, 2017 – June 2, 2017, featuring about 40 technical sessions (oral presentations, interactive presentations, and student posters), 16 professional development courses, a panel discussion, a plenary session, a CPMT Seminar, and a technology corner for exhibitors.
- Official Website: https://www.ectc.net
|IEEE 3DIC 2016||8 November 2016||San Francisco, USA|
|IEEE International Electron Devices Meeting (IEDM) 2016||3 December 2016||San Francisco, USA|
|2017 5th International Workshop on Low Temperature Bonding for 3D Integration (LTB-3D 2017)||16 May 2017||Tokyo, Japan|
|ECTC 2017||30 May 2017||Florida, USA|
|EPTC 2017||6 December 2017||Singapore|