www.3dic.org/Embedded Wafer Level BGA (eWLB)

Embedded Wafer Level Ball Grid Array (eWLB) is a packaging technology for integrated circuits. It is the fisrt fan-out wafer-level packaging (FOWLP) technology.


The eWLB was introduced by Infineon in fall 2007 and then jointly developed by Infineon, and STMicroelectronics, STATS ChipPAC, through a formerly-declared coalition with its technology associates in 2008[1]. In early 2009, Infineon was the first company to commercialize its own eWLB packaging technology in an LG cell-phone. The same eWLB product is in production in some Nokia handsets since 2010.


  1. Infineon, ST and STATS Develops eWLB, Top News, http://topnews.us/content/216577-infineon-st-and-stats-develops-ewlb