Flip-Chip

www.3dic.org/Flip-Chip

Flip-Chip was introduced in 1968 by IBM using the “controlled collapse chip connection” (C4) technology. It uses solder balls in a peripheral or area array to make connections from the package to the substrate.


Flip-Chip, Fan-Out, and 2.5D TSVs

Comparison between (a) flip-chip, (b) 2.5D TSVs, and (c) fan-out packages.

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