FreePDK3D45

www.3dic.org/FreePDK3D45

FreePDK3D45 is a 3D-IC variant of the FreePDKTM process design kit developed by NCSU [1][2].

History

  • June 5, 2009 - Version 1.0 of the FreePDK3D45 has been released. The kit is for a two-tier, face-to-face, bulk process, however the kit is capable of producing a three-tier version with some modification.
  • July 28, 2011 - Version 1.1 of the FreePDK3D45 has been released, featuring a 5-tier technology, new design rules, and instructions for compiling variants of this kit. Many of the improvements from the FreePDK45 1.4 have also been included.


References

  1. http://www.eda.ncsu.edu/wiki/FreePDK3D45:Contents
  2. Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis, Chapter 4 Electrothermal Simulation of Three-Dimensional Integrated Circuits, R. Sharma, K. Iniewski, and S. K. Lim (eds), Design of 3D integrated circuits and systems. Boca Raton, FL: CRC Press, 2015.