FreePDK3D45 is a 3D-IC variant of the FreePDKTM process design kit developed by NCSU [1][2].


  • June 5, 2009 - Version 1.0 of the FreePDK3D45 has been released. The kit is for a two-tier, face-to-face, bulk process, however the kit is capable of producing a three-tier version with some modification.
  • July 28, 2011 - Version 1.1 of the FreePDK3D45 has been released, featuring a 5-tier technology, new design rules, and instructions for compiling variants of this kit. Many of the improvements from the FreePDK45 1.4 have also been included.


  2. Shivam Priyadarshi, Jianchen Hu, Michael B. Steer, Paul D. Franzon, and W. Rhett Davis, Chapter 4 Electrothermal Simulation of Three-Dimensional Integrated Circuits, R. Sharma, K. Iniewski, and S. K. Lim (eds), Design of 3D integrated circuits and systems. Boca Raton, FL: CRC Press, 2015.