Hybrid Memory Cube (HMC)
- HMC specification 1.0  was published in April 2013;
- HMC specification 2.1  on 18 November 2014.
Hybrid Memory Cube Consortium (HMCC)
- Altera (now Intel)
- Micron Technology, Inc
- Open-Silicon, Inc.
- Samsung Electronics Co., Ltd
- SK Hynix
- Xilinx, Inc.
This group is responsible for managing the organization, attending management and adoption meetings, and developing and optimizing the ongoing HMC interface specification.
Products using HMC
|Year||Product||Numbers of HMC chips||Companies|
|2013||EX-800 Blade Server||1 on board||Pico Computing (now Micron)|
|2015||Fujitsu SPARC64 XIfx (PRIMEHPC FX100)||8 on board||Fujitsu|
Multi-channel dynamic random access memory (MCDRAM) is a variant of the Hybrid Memory Cube and was used in the Intel Knights Landing Processors.