Integrated fan-out (InFO) is a FOWLP technology developed by TSMC.


TSMC's (a) InFO, (b) multiple-chip InFO, and (c) InFO PoP.

FO PoP (DRAM-on-Processor)

The Apple A10 SoC processor was packaged by using InFO PoP by TSMC. Above the processor InFO, there is a memory InFO packaging four Samsung LPDDR4 DRAM chips integrating 2 GB of DRAM in the iPhone 7, or 3 GB in the iPhone 7 Plus.

InFO PoP A10.png
Apple A10 processor packaged by FO PoP.

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