SMIC Signs License Agreement For Invensas' DBI Technology
www.3dic.org/News/2017/03/SMIC Signs License Agreement For Invensas' DBI Technology
News source: SMIC, Mar 15, 2017
Semiconductor Manufacturing International Corporation (Chinese:中芯国际, NYSE: SMI; SEHK: 981) ("SMIC"), one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China, has executed a technology transfer and license agreement for Invensas' Direct Bond Interconnect (DBI®) technology. Through this agreement, SMIC will be able to offer this bonding technology for use by image sensor manufacturing customers.
"As one of the leading foundries, SMIC delivers advanced semiconductor manufacturing processes to device makers around the world, and we are pleased to integrate DBI technology into our capabilities," said Dr. Tzu-Yin Chiu (邱慈云), Chief Executive Officer and Executive Director of SMIC. "This technology is a key enabler for the fabrication of 3D stacked image sensors, and by working closely with Invensas, we will accelerate the development and commercialization of a new generation of imaging products for our customers."
DBI technology is a low temperature hybrid wafer bonding solution that allows wafers to be bonded with exceptionally fine pitch 3D electrical interconnect without requiring bond pressure. DBI 3D interconnect can eliminate the need for through-silicon vias (TSVs), reducing die size, and cost while providing a roadmap to pixel level interconnect for future generations of image sensors.
"We are thrilled to enter into this licensing agreement with SMIC, one of the largest and most respected semiconductor foundries in the world," said Craig Mitchell, president of Invensas. "SMIC recognizes the significant benefits of DBI technology for customers worldwide. We look forward to working closely with SMIC to integrate this enabling platform into their world-class design and manufacturing environment."