Package-on-Package (PoP)

www.3dic.org/PoP

Package-on-Package (PoP) is an electronic packaging method to integrate two or more packages into one by vertical stacking. It can be termed as package stacking compared to the chip stacking. Examples of PoP include iPhone A7, A8, A9, and A10 processers.


PoP Shcemes

PoP.png
Standard PoP (left) and Fan-Out PoP (right).


FO PoP

Unlike the Apple A7, A8, and A9 processors using the conventional PoP, the Apple A10 processor was packaged by using the InFO PoP, with a DRAM InFO stacked on the processor InFO.

InFO PoP A10.png
Apple A10 processor packaged by FO PoP.

References