Polymer adhesive bonding

www.3dic.org/Polymer adhesive bonding

Polymer adhesive bonding refers to the technique to join solid surfaces by a polymer adhesive intermediate layer.



Polymer adhesives for permanent bonding

Materials BCB (Dow) PI (Toray, Sumitomo, HD-Micro) PBO (Sumitomo)
Cure Temperature (°C) 210-250 200-350 320

Polymer adhesive bonding

Bonding configuration Bonding temperature References
Soft-baked BCB-to-BCB
Partially-cured (190 °C) BCB-to-BCB 250 °C [1]
(Cured?) BCB-to-Oxide bonding 300 °C [2]
Soft-baked PI-to-InGaAs bonding 300 °C 10 min [3]

References

  1. L.-S. Wu, Y. Zhao, H.-C. Shen, Y.-T. Zhang, and T.-S. Chen, “Heterogeneous integration of GaAs pHEMT and Si CMOS on the same chip,” Chinese Physics B, vol. 25, no. 6, p. 67306, Jun. 2016. Available: http://dx.doi.org/10.1088/1674-1056/25/6/067306
  2. S. L. Lin, W. C. Huang, C. T. Ko, and K. N. Chen, “BCB-to-oxide bonding technology for 3D integration,” Microelectronics Reliability, vol. 52, no. 2, pp. 352–355, Feb. 2012. Available: http://dx.doi.org/10.1016/j.microrel.2011.05.008
  3. T. Maeda, H. Ishii, T. Itatani, E. Mieda, W. Jevasuwan, Y. Kurashima, H. Takagi, T. Yasuda, T. Takada, T. Yamamoto, T. Aoki, T. Osada, O. Ichikawa, and M. Hata, “Ultrathin layer transfer technology for post-Si semiconductors,” Microelectronic Engineering, vol. 109, pp. 133–136, Sep. 2013. Available: http://dx.doi.org/10.1016/j.mee.2013.03.069