SLIM (Silicon-Less Integrated Module)

www.3dic.org/SLIM

SLIM (Silicon-Less Integrated Module) is a packaging technology developed by Amkor. This SLIM™ chip packaging technology leverages the 2.5D sub-micron routing capability and no TSV is required, which lowers cost and improves electrical performance.

SLIM Structure

SLIM-vs-TSV-comparison.png

SLIM-Positioning.png


References