System-in-Package (SiP)

www.3dic.org/SiP

System-in-Package (SiP) is a number of integrated circuits (like CPU SoC, ASIC, memory, analog, and passive components) enclosed in a single electronic package. Chips or packages may be stacked vertically, side-by-side horizontally, or tiled horizontally on a substrate and interconnected by wire bonds or solder bumps.


SiP vs. Multi-Chip Module (MCP) and PoP

A SiP can be either a MCP or a PoP.


References