Through-silicon vias (TSV)

www.3dic.org/TSV

Through-silicon vias (TSVs) are vertical electrical connections (vias) passing through a thinned silicon wafer or die.

Applications

TSV based technologies: 3D SSD, 3D memory, High Bandwidth Memory (HBM)

Backside-illuminated CMOS image sensor (BSI-CIS)

CMOS image sensors were first to adopt TSVs in high volume manufacturing.

2.5D Si Interposer

3D SSD

3D SSD with boost converter and TSVs.png
3D SSD with boost converter and TSVs [1]

TSV Processes

Via-first TSV

Via-middle TSV

Via-last TSV before bonding

Via-last TSV after bonding

References

  1. K. Johguchi, T. Hatanaka, K. Ishida, T. Yasufuku, M. Takamiya, T. Sakurai, and K. Takeuchi, “Through-Silicon Via Design for a 3-D Solid-State Drive System With Boost Converter in a Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 2, pp. 269–277, Feb. 2011. Available: http://dx.doi.org/10.1109/TCPMT.2010.2101930