Through-silicon vias (TSV)
Through-silicon vias (TSVs) are vertical electrical connections (vias) passing through a thinned silicon wafer or die.
Backside-illuminated CMOS image sensor (BSI-CIS)
CMOS image sensors were first to adopt TSVs in high volume manufacturing.
2.5D Si Interposer
3D SSD with boost converter and TSVs 
Via-last TSV before bonding
Via-last TSV after bonding
- K. Johguchi, T. Hatanaka, K. Ishida, T. Yasufuku, M. Takamiya, T. Sakurai, and K. Takeuchi, “Through-Silicon Via Design for a 3-D Solid-State Drive System With Boost Converter in a Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 2, pp. 269–277, Feb. 2011. Available: http://dx.doi.org/10.1109/TCPMT.2010.2101930