Through-silicon vias (TSV)

Through-silicon vias (TSVs) are vertical electrical connections (vias) passing through a thinned silicon wafer or die.


TSV based technologies: 3D SSD, 3D memory, High Bandwidth Memory (HBM)

Backside-illuminated CMOS image sensor (BSI-CIS)

CMOS image sensors were first to adopt TSVs in high volume manufacturing.

2.5D Si Interposer


3D SSD with boost converter and TSVs.png
3D SSD with boost converter and TSVs [1]

TSV Processes

Via-first TSV

Via-middle TSV

Via-last TSV before bonding

Via-last TSV after bonding


  1. K. Johguchi, T. Hatanaka, K. Ishida, T. Yasufuku, M. Takamiya, T. Sakurai, and K. Takeuchi, “Through-Silicon Via Design for a 3-D Solid-State Drive System With Boost Converter in a Package,” IEEE Transactions on Components, Packaging and Manufacturing Technology, vol. 1, no. 2, pp. 269–277, Feb. 2011. Available: