Ultrasonic bonding

www.3dic.org/Ultrasonic bonding

Ultrasonic bonding is a metal-metal bonding method that uses ultrasonic vibration to lower the bonding temperature.

Ultrasonic Bonding Using Au Bumps

Ultrasonic bonding of Au–Au using Au bumps enables low-temperature bonding at 150 °C [1].

Ultrasonic Bonding Using Cone Bumps

The ultrasonic bonding temperature can be lowered to room temperature by using Au [2][3][4][5][6][7] and Cu cone bumps [8].


References

  1. K. Tanida, M. Umemoto, Y. Tomita, M. Tago, R. Kajiwara, Y. Akiyama, and K. Takahashi, “Au Bump Interconnection with Ultrasonic Flip-Chip Bonding in 20 µm Pitch,” Jpn. J. Appl. Phys., vol. 42, no. 4S, p. 2198, Apr. 2003. Available: http://dx.doi.org/10.1143/JJAP.42.2198
  2. T. Shuto, K. Iwanabe, L. J. Qiu, and T. Asano, “Room-temperature high-density interconnection using ultrasonic bonding of cone bump for heterogeneous integration,” in 2013 IEEE 63rd Electronic Components and Technology Conference, 2013, pp. 1141–1145. Available: http://dx.doi.org/10.1109/ECTC.2013.6575717
  3. T. Shuto, K. Iwanabe, K. Noda, S. Nakai, and T. Asano, “Ultrasonic Bonding of Cone Bump for Integration of Large-Scale Integrated Circuits in Flexible Electronics,” Jpn. J. Appl. Phys., vol. 52, no. 5S1, p. 05DB10, May 2013. Available: http://dx.doi.org/10.7567/JJAP.52.05DB10
  4. K. Iwanabe, T. Shuto, and T. Asano, “Analysis of room-temperature bonded compliant bump with ultrasonic bonding,” in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC), 2014, pp. 2303–2307. Available: http://dx.doi.org/10.1109/ECTC.2014.6897627
  5. T. Shuto and T. Asano, “In situ observation of ultrasonic flip-chip bonding using high-speed camera,” Jpn. J. Appl. Phys., vol. 54, no. 3, p. 30204, Jan. 2015. Available: http://dx.doi.org/10.7567/JJAP.54.030204
  6. K. Iwanabe, K. Nakadozono, Y. Senda, and T. Asano, “Room-temperature ultrasonic-bonding characteristics of compliant micro-bump investigated by ex-situ and in-situ measurements,” in 2015 IEEE 17th Electronics Packaging and Technology Conference (EPTC), 2015, pp. 1–5. Available: http://dx.doi.org/10.1109/EPTC.2015.7412363
  7. K. Iwanabe, K. Nakadozono, Y. Senda, and T. Asano, “Bonding dynamics of compliant microbump during ultrasonic bonding investigated by using Si strain gauge,” Jpn. J. Appl. Phys., vol. 55, no. 6S1, p. 06GP22, May 2016. Available: http://dx.doi.org/10.7567/JJAP.55.06GP22
  8. L. Qiu, A. Ikeda, K. Noda, S. Nakai, and T. Asano, “Room-Temperature Cu Microjoining with Ultrasonic Bonding of Cone-Shaped Bump,” Jpn. J. Appl. Phys., vol. 52, no. 4S, p. 04CB10, Apr. 2013. Available: http://dx.doi.org/10.7567/JJAP.52.04CB10