Wafer Level Chip Scale Packaging (WLCSP)
Wafer Level Chip Scale Packaging (WLCSP) is a microelectronic packaging technology, with which the manufacturing process steps are performed at the wafer level rather than on individual chips to achieve a package that is essentially the same size as the die. It evolves from the Flip-Chip packaging, eliminating the substrate. The basic structure of the WLCSP has an active chip surface with polymer coatings and bumps (BGA) with bare silicon exposed on the remaining sides and back of the die. The die can also be encapsulated to improve mechanical robustness and resistance to chipping, cracking and handling damage, and reliability. Comparing to fan-out wafer level package (FOWLP), it can be also termed as fan-in wafer level package (FIWLP).
- Wafer bumping
- FOWLP: Wafer-level packaging of re-assembled dies with fan-out I/Os.